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Introduction  
Sn-Pb Properties and Models  
Sn-Ag Properties and Creep Data  
Sn-Ag-Cu Properties and Creep Data  
General Conclusions/ Recommendations  
Acknowledgements  
References  
     
  For more information contact:  
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Sn-Ag-Cu Properties and Creep Data
 
  Overview  
  "SAC" Creep Data  
  Source and Plot of Data  
  Specimens  
  Microstructures  
  Test Procedures  
  "SAC" Creep Data Analysis and Modeling  
  Fit of Kariya's and Schubert's Models  
  Review of SAC Data  
  Regression Analysis  
  Fit of Additional Data to First Order Creep Model  
  Kim et al.'s Data and Effect of Cooling Rate  
  NCMS' Compression Creep Data  
  Flip-Chip Solder Joint Shear Data  
  Addemdum: Microstructure and Cooling Rate Effects  
  Other "SAC" Properties  
  Young's Modulus vs. Temperature  
  Poisson's Ratio  
  Coefficients of Thermal Expansion (CTE)  
  Other Physical Properties  
  Conclusions on SAC Properties  
 
   
 
Addendum: Microstructure and Cooling Rate Effects
Figure 33: Fit of Joo et al.'s Sn-3.5Ag-0.7Cu, 100°C data to plot of raw SAC tensile data

Figure 33: Fit of Joo et al.'s Sn-3.5Ag-0.7Cu, 100°C data to plot of raw SAC tensile data. "TS" = Thermally Stabililized; FC = Fast Cooled (at 145°K/sec).

In addition to Kim et al.'s data, the Joo et al. (2002) Sn-3.5Ag-0.7Cu data also confirms the strong effect of cooling rate and microstructure on creep properties. Joo et al. conducted creep tests at 100°C on two types of dog-bone shaped tensile specimens:

  • "TS" specimens: 5 mm thick, 8 mm wide x 32 mm long tensile section; cast alloys were cold rolled at about 50% and heat-treated or Thermally Stabilized (TS) for 12 hours at 393°K. The resulting size of the beta-Sn dendritic globules (prior to testing) was 50-100 µm.
  • "FC" specimens: 1 mm thick, 8 mm wide x 19 mm long tensile section; specimens that were cast in a thin aluminum mold were water quenched from the melting point at a cooling rate of about 145°K/sec (FC = Fast-Cooled). The resulting size of the beta-Sn dendritic globules (prior to testing) was 5-10 µm.

The secondary creep results are added to our first plot of raw creep data (Figure 23) as shown in Figure 33. The raw data, digitized from Figure 5 in Joo et al. (2002), is listed in Table B.5. To a first order, and in spite of slight differences in Ag and Cu contents, the Joo et al. FC data seems to fit in with the other datasets:

  • The 100°C FC data falls between the 70°C and 150°C Schubert data. We cannot be more conclusive on this because the Schubert et al. paper did not report on cooling rates and the size of the beta-Sn globules.
  • By extrapolation to stress levels in the range 10 to 20 MPa, the 100°C FC data also shows continuity with the Kariya et al.'s data and would fall somewhere between the Kariya et al.'s datasets at 75°C and 125°C. This is encouraging since the Kariya et al.' specimens were also rapidly cooled (waterquenched) with a grain size of the beta-Sn globules given at approximately 5 mm, similar to the 5-10 µm globules in Joo's FC specimens.

On the other end, the 100°C TS data from Joo et al. is offset from the rest and lies about two orders of magnitude above the FC data in the direction of the strain rate axis. As discussed in Joo et al. (2002), and from elementary material science, this offset between the FC and TS data is mostly due to differences in the micro-structures (5-10 µm beta-Sn globules for FC vs. 50-100 µm globules for TS). The two order-of magnitude effect from the Joo et al.'s data is also consistent with the 100 X difference in strain rates for the SC and RC specimens of Kim et al.


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