Materials Performance Group

Mechanical Properties

Mechanical Properties of Intermetallic Compounds Formed Between Tin (Solder) and Copper or Nickel

• Hardness as a function of temperature for Cu₆Sn₅, Cu₃Sn, and Ni₃Sn₄
• Toughness as a function of temperature for Cu₆Sn₅, Cu₃Sn, and Ni₃Sn₄
• Elastic moduli, thermal expansion coefficient, resistivity, heat capacity, density, thermal diffusivity, and thermal conductivity at room temperature for Cu₆Sn₅, Cu₃Sn, and Ni₃Sn₄
• Explanatory text for above information including references

Phase Equilibria in the Copper and Tin System

• Copper and Tin binary phase diagrams